Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors

Luis Fernando Toapanta Ramos; Cristian Andrés Andrade Terán; Emilio Josue Davalos Alvarez; Darío Sebastián Landázuri Zaldumbide; William Giovanny Quitiaquez Sarzosa

doi:10.29019/enfoque.v10n2.469

Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors

Título traducido de la contribución: Análisis térmico del disipador de calor con tubos de calor para procesadores de alto rendimiento

Luis Fernando Toapanta Ramos, Cristian Andrés Andrade Terán, Emilio Josue Davalos Alvarez, Darío Sebastián Landázuri Zaldumbide, William Giovanny Quitiaquez Sarzosa

Producción científica: Contribución a una revista › Artículo

Resumen

El objetivo de este documento es proponer el análisis térmico de un dispositivo disipador de calor mediante el uso de tubos de calor que contienen diferentes fluidos, los cuales son agua, refrigerante R134a y metanol para la evaluación de estos dispositivos bajo ciertas características de diseño, debido a que en la actualidad los procesadores tienen un mayor consumo de energía y mayores capacidades de procesamiento, lo que provoca una elevación significativa de la temperatura ante cargas de trabajo exigentes. Mediante el uso del software de simulación ANSYS, se realizó el estudio térmico del dispositivo, además del gradiente de temperatura generado en el mismo al entrar en contacto con una superficie caliente, que va a ser un procesador de alto rendimiento, demostrando que se pueden obtener temperaturas estables mediante el uso de tubos de calor ante cargas de trabajo exigentes, asegurando el correcto funcionamiento y refrigeración del procesador.

Título traducido de la contribución	Análisis térmico del disipador de calor con tubos de calor para procesadores de alto rendimiento
Idioma original	Inglés estadounidense
Páginas (desde-hasta)	39-51
Número de páginas	13
Publicación	Enfoque Ute
Volumen	10
N.º	10
DOI	https://doi.org/10.29019/enfoque.v10n2.469
Estado	Publicada - 28 jun. 2019

Palabras clave

Ansys
Heat pipe
Heat transfer
Heatsink
Thermal analysis

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727A Diseño industrial y de procesos

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title = "Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors",

abstract = "The objective of this document is to propose the thermal analysis of a heat dissipating device by using heat pipes containing different fluids, which are water, refrigerant R134a and methanol for the evaluation of these devices under certain design characteristics, due to the fact that at present the processors have a higher energy consumption and greater processing capacities, which causes a significant elevation of the temperature before demanding workloads. Through the use of the ANSYS simulation software, the thermal study of the device was carried out; in addition, the temperature gradient generated in it when in contact with a hot surface, which is going to be a high performance processor, demonstrating that stable temperatures can be obtained through the use of heat pipes at demanding workloads, ensuring correct operation and cooling of the processor.",

keywords = "Ansys, Heat pipe, Heat transfer, Heatsink, Thermal analysis, Ansys, Heat pipe, Heat transfer, Heatsink, Thermal analysis",

author = "{Toapanta Ramos}, {Luis Fernando} and {Andrade Ter{\'a}n}, {Cristian Andr{\'e}s} and {Davalos Alvarez}, {Emilio Josue} and {Land{\'a}zuri Zaldumbide}, {Dar{\'i}o Sebasti{\'a}n} and {Quitiaquez Sarzosa}, {William Giovanny}",

year = "2019",

month = jun,

day = "28",

doi = "10.29019/enfoque.v10n2.469",

language = "English (US)",

volume = "10",

pages = "39--51",

journal = "Enfoque Ute",

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T1 - Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors

AU - Toapanta Ramos, Luis Fernando

AU - Andrade Terán, Cristian Andrés

AU - Davalos Alvarez, Emilio Josue

AU - Landázuri Zaldumbide, Darío Sebastián

AU - Quitiaquez Sarzosa, William Giovanny

PY - 2019/6/28

Y1 - 2019/6/28

N2 - The objective of this document is to propose the thermal analysis of a heat dissipating device by using heat pipes containing different fluids, which are water, refrigerant R134a and methanol for the evaluation of these devices under certain design characteristics, due to the fact that at present the processors have a higher energy consumption and greater processing capacities, which causes a significant elevation of the temperature before demanding workloads. Through the use of the ANSYS simulation software, the thermal study of the device was carried out; in addition, the temperature gradient generated in it when in contact with a hot surface, which is going to be a high performance processor, demonstrating that stable temperatures can be obtained through the use of heat pipes at demanding workloads, ensuring correct operation and cooling of the processor.

AB - The objective of this document is to propose the thermal analysis of a heat dissipating device by using heat pipes containing different fluids, which are water, refrigerant R134a and methanol for the evaluation of these devices under certain design characteristics, due to the fact that at present the processors have a higher energy consumption and greater processing capacities, which causes a significant elevation of the temperature before demanding workloads. Through the use of the ANSYS simulation software, the thermal study of the device was carried out; in addition, the temperature gradient generated in it when in contact with a hot surface, which is going to be a high performance processor, demonstrating that stable temperatures can be obtained through the use of heat pipes at demanding workloads, ensuring correct operation and cooling of the processor.

KW - Ansys

KW - Heat pipe

KW - Heat transfer

KW - Heatsink

KW - Thermal analysis

KW - Ansys

KW - Heat pipe

KW - Heat transfer

KW - Heatsink

KW - Thermal analysis

UR - https://ingenieria.ute.edu.ec/enfoqueute/index.php/revista/article/view/469

U2 - 10.29019/enfoque.v10n2.469

DO - 10.29019/enfoque.v10n2.469

M3 - Article

SN - 1390-6542

VL - 10

SP - 39

EP - 51

JO - Enfoque Ute

JF - Enfoque Ute

IS - 10

ER -

Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors

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