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Tempering Temperature Effect on Microstructure and Mechanical Response of Isobloc W302 (H13) Steel

  • Nicolás Pinto-Guanotasig
  • , Cristian Leiva
  • , Santiago Castellanos
  • , Xavier Sánchez-Sánchez

Producción científica: Capítulo del libro/informe/acta de congresoContribución de conferenciarevisión exhaustiva

Resumen

The present investigation studied the effect of tempering temperature on the mechanical properties of Isobloc W302 (H13) steel used for mold production and hot working applications. Because the material is tempered to offer higher wear resistance, it considerably reduces its ductility, affecting its durability. For this reason, an experimental design is employed to find suitable temperature levels for tempering to relieve stresses and lower the hardness of the mold in such a way as to increase the material ductility. Two main heat treatments were employed: quenching and austempering, and five levels of tempering temperatures between 300 and 650 °C were evaluated. The resulting microstructure was examined by optical microscopy, and the hardness and tensile strength of the material were also evaluated for each experimental level of tempering temperature. The results show that quenching and tempering at 400 °C improves the mechanical response while maintaining the hardness to a level suitable for operation.

Idioma originalInglés
Título de la publicación alojadaEmerging Research in Intelligent Systems - Proceedings of the CIT 2024-Volume 1
EditoresGonzalo Fernando Olmedo Cifuentes, Diego Gustavo Arcos Avilés, Hernán Vinicio Lara Padilla
EditorialSpringer Science and Business Media Deutschland GmbH
Páginas242-254
Número de páginas13
ISBN (versión impresa)9783031877032
DOI
EstadoPublicada - 2025
Evento19th International Multidisciplinary Congress on Science and Technology, CIT 2024 - Sangolquí, Ecuador
Duración: 21 oct. 202425 oct. 2024

Serie de la publicación

NombreLecture Notes in Networks and Systems
Volumen1347 LNNS
ISSN (versión impresa)2367-3370
ISSN (versión digital)2367-3389

Conferencia

Conferencia19th International Multidisciplinary Congress on Science and Technology, CIT 2024
País/TerritorioEcuador
CiudadSangolquí
Período21/10/2425/10/24

Nota bibliográfica

Publisher Copyright:
© The Author(s), under exclusive license to Springer Nature Switzerland AG 2025.

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