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Cheating on academic evaluations: Differences between administrative sciences and engineering majors

Producción científica: Capítulo del libro/informe/acta de congresoContribución de conferenciarevisión exhaustiva

Resumen

Academic dishonesty is a general problem that has been present in universities worldwide during decades and its impact varies from university to university. This paper analyzes the result of a survey applied to a stratified sample of 622 engineering and administration and economics sciences students of Universidad Politecnica Salesiana (UPS) in Ecuador, with a confidence level of 95%, Zα=1,96 and an error of 5%. The results show the percentage of students that cheat in their evaluations in order to improve their grades, how they do it and what students are more prone to committing academic dishonesty. The results were compared to other related research from the United States, Hong Kong, Russia and Poland; thus demonstrating the need to promote courses and workshops aimed at professors, on the implementation of didactic strategies to reduce dishonest practices.

Idioma originalInglés
Título de la publicación alojada2019 Congreso Internacional de Innovacion y Tendencias en Ingenieria, CONIITI 2019 - Conference Proceedings
EditoresMonica Andrea Rico Martinez
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728147468
DOI
EstadoPublicada - oct. 2019
Evento2019 Congreso Internacional de Innovacion y Tendencias en Ingenieria, CONIITI 2019 - 5th International Conference on Innovation and Trends in Engineering, CONIITI 2019 - Bogota, Colombia
Duración: 2 oct. 20194 oct. 2019

Serie de la publicación

Nombre2019 Congreso Internacional de Innovacion y Tendencias en Ingenieria, CONIITI 2019 - Conference Proceedings

Conferencia

Conferencia2019 Congreso Internacional de Innovacion y Tendencias en Ingenieria, CONIITI 2019 - 5th International Conference on Innovation and Trends in Engineering, CONIITI 2019
País/TerritorioColombia
CiudadBogota
Período2/10/194/10/19

Nota bibliográfica

Publisher Copyright:
© 2019 IEEE.

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