Thermal Analysis of Heat Sink with Heat Pipes for High Performance Processors

Luis Fernando Toapanta Ramos, Cristian Andrés Andrade Terán, Emilio Josue Davalos Alvarez, Darío Sebastián Landázuri Zaldumbide, William Giovanny Quitiaquez Sarzosa

Research output: Contribution to journalArticle


The objective of this document is to propose the thermal analysis of a heat dissipating device by using heat pipes containing different fluids, which are water, refrigerant R134a and methanol for the evaluation of these devices under certain design characteristics, due to the fact that at present the processors have a higher energy consumption and greater processing capacities, which causes a significant elevation of the temperature before demanding workloads. Through the use of the ANSYS simulation software, the thermal study of the device was carried out; in addition, the temperature gradient generated in it when in contact with a hot surface, which is going to be a high performance processor, demonstrating that stable temperatures can be obtained through the use of heat pipes at demanding workloads, ensuring correct operation and cooling of the processor.
Translated title of the contributionAnálisis térmico del disipador de calor con tubos de calor para procesadores de alto rendimiento
Original languageEnglish (US)
Pages (from-to)39-51
Number of pages13
JournalEnfoque Ute
Issue number10
StatePublished - 28 Jun 2019


  • Ansys
  • Heat pipe
  • Heat transfer
  • Heatsink
  • Thermal analysis

CACES Knowledge Areas

  • 727A Industrial and process design


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