Numerical Study Using CFD on Heat Sinks for Electronic Components

In the present study, a numerical investigation is ca-rried out using ANSYS CFD to observe the heat transfer and heat dissipation, the method is by forced convection heat transfer, with a modern and innovative heat sink. In the study, a configuration of six vertical central fins of equal size and three small fins horizon-tally is observed. With the lower surface heated, this simulates the heat rejection of electronic devices such as video cards in CPUs. The Navier-Stokes equations for fluid dynamics and the Kappa-Epsilon turbulence model based on RNG (Renormalization) are establis-hed for this study. The temperature in the air surrounding the heat sink increases by 0.62 to 0.79°C, for the base temperature of 80°Cand 100°C, respectively. This means that at a higher air flow speed, 20m/s, the air has the capacity to heat up more since its heat ex-change is stronger, therefore, the heat sink reduces its temperature.